precision voltage regulator sg723 ? positive or negative supply operation ? series, shunt, switching or floating operation ? low line and load regulation ? output adjustable from 2 v to 37 v ? output current to 150 ma ? low standby current drain ? 0.002%/c average temperature variation high re liability features ? mil-m38510/10201bha - SG723F-JAN this monolithic voltage regulator is designed for use with either positive or negative supplies as a series, shunt, switching, or floating regulator with currents up to 150 ma. higher current requirements may be accommodated through the use of external npn or pnp power transistors. this device consists of a temperature compensated reference amplifier, error amplifier, power series pass transistor, current limit, and remote shutdown circuitry. the sg723 will operate over the full military ambient temperature range of -55c to 125c. features description ? mil-m38510/10201bia - sg723t-jan ? mil-m38510/10201bca - sg723j-jan ? msc-ams l evel "s" processing available block diagram june 2015 rev. 1.4 1 www.microsemi.com ? 20 15 microsemi c orporation downloaded from: http:///
pulse (50 ms) input voltage from v in to v- ......................... continuous input voltage from v in to v- ............................. input to output voltage differential .................................... maximum output current .............................................. current from v z (j-package only)................................... current from v ref ............................................................... operating junction temperature hermetic (t, j, f - packages)..................................... storage temperature range ........................... lead temperature (soldering, 10 s ) ................................ 15 ma 150 c -65 c to 150 c 300 c 50 v40 v 40 v 150 ma 25 ma note 1. exceeding these ratings could cause damage to the device. j package: thermal resistance- junction to case , jc .................. 30c/w thermal resistance- junction to ambient , ja .............. 80c/w t package: thermal resistance- junction to case , jc .................. 25c/w thermal resistance- junction to ambient , ja ........... 130c/w f package: thermal resistance- junction to case , jc ................... 80c/w thermal resistance- junction to ambient , ja ........... 145c/w note a. junction temperature calculation: t j = t a + (p d x ja ) . note b. the above numbers for j c are maximums for the limiting thermal resistance of the package in a standard mounting configuration. the ja numbers are meant to be guidelines for the thermal performance of the device/ pc- board system. all of the above assume no ambient airflow. input voltage range ................................. output current range ........................................ reference current............................................................. (v out +4.5 v) to 38 v 5 ma to 45 ma 5 ma zener current (j-package only)......................................... operating ambient temperature range sg723 .......................................................... 5 ma -55c to 125c note 2. range over which the device is functional. (unless otherwise specified, these specifications apply for the operating ambient temperature of t a = 25c, v in = v c = 12 v, v- = 0 v, v out = 5 v, i l = 1 ma, r sc = 0 , c 1 = 100 pf, and divider impedance as seen by error amplifier 10 k . low duty cycle pulse testing techniques are used which maintains junction and case temperatures equal to the ambient temperature.) test conditions parameter input voltage range output voltage range input to output differential line regulation (note 3) load regulation (note 3) ripple rejection temperature stability (note 4) short circuit current limit reference voltage output noise voltage standby current drain long term stability units vv v %v out %v out %v out %v out %v out dbdb %/c ma v v rms v rms ma %/ k hr v in = 12 v to 15 v t a = t min to t max v in = 12 v to 40 v i l = 1 to 50 ma t a = t min to t max f = 50 hz to 10 k hz c ref = 0 c ref = 5 f t a = t min to t max r sc = 10 bw = 100 hz to 10 k hz c ref = 0 c ref = 5 f i l = 0, v in = 30 v note 4. these parameters, although guaranteed, are not tested in production. note 3. applies for constant junction temperature. temperature drift effects must be taken into account separately when the unit is operating under conditions of high dissipation. sg723 min. typ. max. 4037 38 0.10.3 0.2 0.15 0.6 0.015 7.35 3.5 0.010.02 0.03 7486 0.002 65 7.15 20 2.52.3 0.1 9.52.0 3.0 6.95 2 absolute maximum ratings (note 1) thermal data recommended operating conditions (note 2) electrical characteristics downloaded from: http:///
figure 6. tr ansient r esponse figure 5. standby current drain figure 3. current limiting characteristics figure 2. maximum load current figure 1. load regulation figure 4. regulations vs. input-output voltage regulation figure 7 - b asic low voltage regulator v out = 2 v to 7 v figure 8 - basic high voltage regulator v out = 7 v to 37 v 3 characteristic curves application information 100 pf 100 pf t- packaget a = 25c. free air derate linearly for maximum juntion temperature of 150c for t-package 160 downloaded from: http:///
f igure 9 - h igh c urrent r egulator e xternal npn t ransistor i l = 1.0 a f igure 10 - n egative v oltage r egulator note 1. contact factory for jan product availablity. 2. all packages are viewed from the top. lead finish is sn63/pb37 for rohs compliant version contact factory. ambient temperature range package part n umber connection diagram 10-pin ceramic flat pack f - package (note 3) 3. v z output is not available in t, f-packages. 4. pin 5 is connected to case. SG723F-JAN -55c to 125c current limitv out 97 86 12 3 4 5 10 v c v in freq. comp. current sense inverting input non-inverting input v ref v- 4 application information (continued) connection diagrams and ordering information (see notes below) 100 pf 100 pf 3 k 3 k 2 k sg723t-jan sg723t -55c to 125c -55c to 125c 10-pin metal can t - package (notes 3 & 4) 3 2 14 5 6 7 8 9 10 current limit non-inverting input v ref v in v c v- inverting input current sense v out 14-pin ceramic dip j - package sg723j-jan -55 c to 125 c 23 4 5 16 7 1413 10 1211 98 n.c. current limit current sense inverting input non-inverting input v ref v- n.c.freq. compensation v in v c v out v z n.c. freq. compensation downloaded from: http:///
package outline dimensions controlling di mensions are i n inches, metric equivalents ar e shown for g eneral i nformation. 5 figure 11 f 10-pin cer amic flat-pack package outline dimensions e b d s1 c e l e1 a q 1 2 3 4 5 67 8 9 10 l d im millimeters inches min max min max a 1.45 1.9 0 0.057 0.075 b 0.25 0.483 0.010 0.019 c 0.102 0.152 0.004 0.006 d - 7.37 - 0.290 e 6.04 6.40 0.238 0.252 e1 - 6.91 - 0.272 e 1.27 bsc 0.050 bsc l 6.35 9.40 0.250 0.370 q 0.51 1.02 0.020 0.040 s1 0.20 0.38 0.008 0.015 note: 1. lead no. 1 is i dentified by tab on l ead or dot on c over. 2. leads ar e within 0.13 mm ( .0005) radius of t he t rue position (tp) at m aximum m aterial condition. 3. dimension e determines a z one within which all body and lead irregularities l ie. 4. dimensions ar e in mm, i nches ar e for r eference only. figure 12 j 14-pin ceramic dip package dimensions a 5.08 0.200 b 0.38 0.51 0.015 0.020 b2 1.04 1.65 0.045 0.065 c 0.20 0.38 0.008 0.015 d 19.30 19.94 0.760 0.785 e 5.59 7.11 0.220 0.280 e 2.54 bsc 0.100 bsc ea 7.37 7.87 0.290 0.310 h 0.63 1.78 0.025 0.070 l 3.18 5.08 0.125 0.20 0 - 15 - 15 q 0.51 1.02 0.020 0.040 note: dimensions do not include protrusions; these shall not exceed 0.155 mm (.006) on any side. lead dimension shall not include solder coverage. d 14 8 e 1 ea q a b2 l c h e b 7 q millimeters inches min max min max dim - - downloaded from: http:///
package outline dimensions (continued) k k1 d2 a d1 d b1 l f 1 seating l1 plane 10 e note: dimensions do not i nclude protrusions; t hese shall not ex ceed 0.155 mm ( .006) on any s ide. lead dimension s hall not incl ude solder coverage. m illimeters i nches min max min max d 8.890 9.398 0.350 0.370 d1 8.00 8.51 0.315 0.335 a 4.191 4.699 0.165 0.185 b1 0.406 0.533 0.016 0.021 f - 1.016 - 0.040 e 5.842 typ 0.230 typ k 0.711 0.864 0.028 0.034 k1 0.737 1.143 0.029 0.045 l 12.70 14.48 0.500 0.570 36 typ 36 typ d2 3.556 4.064 0.140 0.160 l1 0.254 1.016 0.010 0.040 figure 1 3 t 10- pin metal can package dimensions dim 6 downloaded from: http:///
sg723 -1.4/06.15 microsemi corporate headquarters one enterprise, aliso viejo, ca 92656 usa within the usa : +1 (800) 713-4113 outside the usa : +1 (949) 380-6100 sales : +1 (949) 380-6136 fax : +1 (949) 215-4996 e-mail: sales.support@microsemi.com microsemi corporation (mscc) offers a comprehensive portfolio of semiconductor and system solutions for communications, defense & security, aerospace and industrial markets. products include high-performance and radiation-hardened analog mixed-signal integrated circuits, fpgas, socs and asics; power management products; timing and synchronization devices and precise time solutions, setting the world's standard for time; voice processing devices; rf solutions; discrete components; security technologies and scalable anti-tamper products; ethernet solutions; power-over-ethernet ics and midspans; as well as custom design capabilities and services. microsemi is headquartered in aliso viejo, calif., and has approximately 3,600 employees globally. learn more at www.microsemi.com. ? 2015 microsemi corporation. all rights reserved. microsemi and the microsemi logo are trademarks of microsemi corporation. all other trademarks and service marks are the property of their respective owners. microsemi makes no warranty, representation, or guarantee regarding the information contained herein or the suitability of its products and services for any particular purpose, nor does microsemi assume any liability whatsoever arising out of the application or use of any product or circuit. the products sold hereunder and any other products sold by microsem i have been subject to li mited testing and should not be used in conjunction with missi on-critical equipment or applications. any performance specifications are believed to be reliable but are not verified, and buyer must conduct and complete all performance an d other testing of the products, alone and together with, or installed in, any end-products. buyer shall not rely on any data and performance specifications or para meters provided by micr osemi. it is the buyer's responsibility to independently determine suitability of any products and to test and verify the same. the information provided by microsemi hereunder is provi ded "as is, where is" and with all faults, and the entire risk associated with such information is entirely with the buyer. microsemi does not grant, explicitly or implicitly, to any party any patent rights, licenses, or any other ip rights, whether with regard to such information itself or anything described by such in formation. information provided in this document is proprietary to microsemi, and microsemi reserves the ri ght to make any changes to the information in this document or to any products and services at any time without notice. downloaded from: http:///
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